Job Description:

• Serve as the primary Equipment Owner and Subject Matter Expert (SME) for wafer bonding equipment within the Lithography (Photo) Department, ensuring best-in-class equipment performance, reliability, and manufacturing capability.
• Lead the evaluation, selection, qualification, and deployment of new equipment, technologies, and capital investments to support business growth and technology roadmap requirements.
• Drive equipment strategy, lifecycle management, and continuous improvement initiatives to achieve operational excellence in yield, uptime, throughput, and cost efficiency.
• Lead equipment installation, qualification, conversion, transfer, upgrades, and sustaining activities for wafer bonders, Gemini bonders, SAM Coat, and associated process equipment.
• Establish long-term reliability improvement plans by analyzing equipment performance, identifying chronic issues, and implementing sustainable corrective and preventive actions.
• Partner with process, manufacturing, quality, facilities, and global engineering teams to resolve complex technical challenges affecting production and customer commitments.
• Manage and drive equipment vendors to achieve performance targets related to uptime, MTTR, MTBF, OEE, spare parts management, and service responsiveness.
• Lead cross-functional projects focused on yield enhancement, cycle-time reduction, defect reduction, capacity expansion, cost optimization, and automation implementation.
• Utilize SPC, FDC, equipment intelligence, and advanced data analytics to identify opportunities for process and equipment optimization.
• Champion alarm reduction, equipment robustness, predictive maintenance, and Industry 4.0 initiatives through machine control and data-driven methodologies.
• Develop and standardize best practices, maintenance strategies, troubleshooting methodologies, OCAPs, and engineering procedures across the department.
• Act as technical lead during critical tool excursions, ensuring effective root cause analysis and timely recovery plans.
• Mentor and coach engineers, technicians, and production personnel to strengthen technical competencies and troubleshooting capabilities.
• Provide technical leadership during NPI, process transfer, customer qualification, and manufacturing scale-up activities.
• Drive a culture of continuous improvement, operational discipline, and engineering excellence across the Photo Department.

Job Requirements:

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
• Minimum 3 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
• Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
• Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
• Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
• Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
• Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
• Excellent communication, interpersonal, and stakeholder management skills.
• Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.