Key Responsibilities

Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.

Establish, review and update specifications, workflow, quality and safety related documentation for production line.

Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.

Process sustaining and control through SPC and periodic defect Pareto Analysis.

Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.

Coordinate and liaise with vendor/suppliers on process issue or quality issue.

Support customer NPI activities and internal engineering activities.

New material, process & machine development and qualification.

Handle and manage customer audits and 8D reports.

Provide disposition for engineering and production lots.

Conduct process characterization and qualification to establish process baseline.

Any other ad-hoc duties as assigned.

Requirements

Bachelor’s Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees.

At least 3-years hands-on process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line in either Wet, PVD, Lithography or AOI.

Knowledge in process engineering, process control engineering and yield enhancement.

Experience in SPC, DOE, FEMA, and 8D reports