Join a leading semiconductor manufacturing environment driving advanced plating and wet process technologies.

Key Responsibilities

• Develop, optimize, and sustain electroplating processes such as Cu, Ni, and SnAg
• Support wet processes including etching, cleaning, stripping, and surface preparation
• Troubleshoot plating and wet process defects to improve yield and process stability
• Conduct DOE, process qualification, SPC monitoring, and root-cause analysis
• Perform laboratory analysis including chemical titration, CVS, TOC, and failure analysis
• Collaborate with Quality, Production, and R&D teams on process and product improvements
• Support equipment maintenance, process documentation, and EHS compliance

Requirements

• Degree in Chemical Engineering, Materials Engineering, Chemistry, or related field
• Experience in electroplating, semiconductor packaging, or wet chemical processes preferred
• Knowledge of plating chemistry, surface finishing, and wet process controls
• Familiarity with SPC, DOE, FMEA, and problem-solving methodologies
• Strong analytical, troubleshooting, and communication skills

Ideal for candidates passionate about semiconductor process engineering, chemical process optimization, and manufacturing excellence.

If you believe you fit the requirements for the role, please click APPLY NOW or you can email your CV to moh•••••••••@ambition.com.sg

Data provided is for recruitment purposes only. Business License Number: 10C5117. EA Registration Number: R22110278. Regrettably, only shortlisted candidates will be notified.