Job Description

Job Overview

We are seeking an experienced Metrology Application Engineer to support advanced semiconductor metrology operations, with a focus on thin film thickness and material characterization.

The role will be responsible for tool setup, recipe development, cross-tool matching, and SPC control for state-of-the-art metrology platforms such as:

Rigaku XRF/XRR, Primus system

KLA optical thickness system (SS10K/ASET family)

KLA optical defect inspection system (SP3/SP7)

This position plays a critical role in enabling high-precision metrology capability, process control, and tool-to-tool matching in a fast paced R&D lab environment.

Key Responsibilities

1. Metrology Tool Ownership & Application Development

Own and support thin film metrology tools (XRF/XRR, optical thickness, defect inspection).

Develop, qualify, and release measurement recipes for various material stacks (Cu, dielectric, metal films, etc.).

Ensure measurement accuracy, repeatability, and robustness across process flows.

2. Tool Matching & Correlation

Establish and maintain tool-to-tool matching across identical and dissimilar platforms.

Perform cross-site / cross-tool correlation

Support cross site/lab matching activities to ensure consistent measurement output across tools.

3. Recipe Development & Optimization

Develop and optimize recipes for:

Measurement accuracy (thickness, density, composition)

Throughput and stability

Signal quality and noise reduction

Work closely with process and integration teams to support new film/material introduction and process changes.

Support DOE and characterization plan for new films and stacks.

4. SPC & Process Control

Define and implement SPC strategies for metrology:

Control chart setup

Baseline and control limit tuning

Monitor metrology performance and drive continuous improvement initiatives.

Identify and resolve measurement drifts, excursions, and tool-induced variability.

Cross-functional Collaboration

Work closely with:

Process engineering

Equipment engineering

External partners

Support training and knowledge transfer for technicians and engineers.

Qualifications & Requirements

Education

Bachelor’s degree in:

Materials Engineering

Physics/Chemistry

Electrical Engineering or Semiconductor-related discipline

Experience

3–5+ years of experience in semiconductor metrology / process engineering

Hands-on experience with:

XRF / XRR (Rigaku or equivalent)

Optical thickness tools (KLA SS10K / ASET etc)

Tool matching and correlation

Recipe development and optimization

SPC implementation and monitoring

Technical Skills

Strong understanding of:

Thin film physics (density, roughness, composition)

Measurement principles (X-ray, reflectometry, optical)

Familiar with DOE and data analysis

Ability to troubleshoot measurement discrepancies and tool drift issue.

Soft Skills

Strong analytical and problem-solving skills

Fast leaner & ability to work in a fast-paced R&D lab environment