Position Summary

The NPI Engineer will be responsible for supporting new product introduction (NPI) activities and ensuring smooth transition from development to high-volume manufacturing. This role will work closely with cross-functional teams to establish, qualify, and optimize manufacturing processes across semiconductor operations including lithography, wet processes, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend processes. 

Responsibilities 

New Product Introduction (NPI) 

Lead and support NPI builds from prototype through engineering and qualification stages to mass production.  

Drive process setup, line readiness, and material qualification for new products.  

Collaborate with R&D, Product Engineering, and Quality teams to ensure manufacturability and process robustness.  

Develop and review process flow, work instructions, FMEA, and control plans for new products.  

Coordinate engineering builds, monitor progress, and resolve technical issues during NPI phases.  

Support customer requirements, audits, and documentation for product qualification.  

Process Engineering & Operations Support 

Provide technical support for assigned backend processes 

Troubleshoot process excursions, yield issues, and equipment-related problems.  

Analyze process data, SPC trends, and implement corrective and preventive actions (CAPA).  

Drive continuous improvement initiatives to enhance yield, quality, and cycle time.  

Support production in achieving output, quality, and cost targets.  

Work closely with Equipment, Quality, Production, and Supply Chain teams to ensure seamless operations.  

Interface with suppliers and vendors for material and equipment-related qualifications.  

Participate in design reviews and provide DFM (Design for Manufacturability) feedback.  

Maintain accurate documentation for process specifications, changes, and qualifications.  

Ensure compliance with internal standards, customer requirements, and industry regulations.  

Support audits (internal, customer, and certification audits).  

Requirements 

Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field.  

At least 5 years of experience in semiconductor manufacturing, preferably in backend/advanced packaging.  

Experience in NPI, process development, or high-mix manufacturing environment is an advantage.  

Familiarity with semiconductor processes such as lithography, wet, die prep, PnP, recon, and molding.  

Strong problem-solving skills with knowledge of root cause analysis tools (e.g., 8D, Fishbone, FMEA).  

Experience with SPC, DOE, and data analysis tools is preferred.  

Good communication and stakeholder management skills.  

Ability to work in a fast-paced, high-volume manufacturing environment.  

Preferred Skills 

Knowledge of advanced packaging technologies (e.g., fan-out, wafer-level packaging).  

Hands-on experience with automation and MES systems.  

Six Sigma / Lean certification is a plus.