Job description for Applications Engineer at Palomar Technologies (S.E. Asia) Pte Ltd
Status: Full Time
Title: Applications Engineer
Reports to: Advanced Solutions Division Manager, APAC
Location: Singapore, Palomar Technologies (SE Asia) Pte Ltd
Job Description
Palomar Singapore Innovation Center is seeking an Applications Engineer to join our Advance Solutions team. The role requires strong expertise in die bonding and wire bonding processes, including programming and familiarity with advanced packaging materials. The candidate should also be willing to expand their skillset to include vacuum reflow processes.
As part of the team in Singapore, the successful candidate will be expected to handle a variety of responsibilities and support different activities within the Applications lab.
Note: The Palomar laboratory typically operates during regular business hours, though occasional extended hours may be required to support project demands.
Major Duties & Responsibilities:
§ Develop, optimize, and sustain die bonding and wire bonding processes, including material selection, process setup, and equipment programming to meet application and production requirements.
§ Support the development, qualification, and continuous improvement of vacuum reflow processes, including material evaluation and process optimization.
§ Establish, document, and maintain process work instructions to ensure consistency, repeatability, and compliance with quality standards.
§ Drive process characterization, troubleshooting, and root cause analysis to improve yield, reliability, and overall process performance.
§ Analyze results, maintain accurate documentation, and generate comprehensive technical reports to support customer and internal requirements.
§ Ensure proper use, maintenance, and calibration of equipment to support consistent process performance and quality standards.
Key Job Duties & Skill Requirements:
§ Possess a strong working knowledge of material science, including various solder types, alloy compositions, epoxies, ceramics, and other advanced packaging materials, as well as their behavior under different time, temperature, and force conditions.
§ Demonstrated experience or knowledge in die bonding and wire bonding processes, including process setup, optimization, and troubleshooting.
§ Ability to independently support pre-sales application activities by addressing complex customer assembly challenges, taking into account customer materials, specifications, and packaging techniques, while aligning with process and equipment capabilities.
§ Strong communication skills to effectively engage with customers on new projects, gather and define technical requirements, and develop practical, process-driven solutions.
§ Ability to plan and design processes for customer sample builds, including program development and process setup. This includes collaborating with the team, applying critical thinking, and executing practical solutions.
§ Maintain a clean, organized, and safe laboratory and equipment environment in support of team operations.
Skills, Education and Qualifications
§ Bachelor’s Degree in Engineering is preferred; a Diploma in Science or Engineering-related fields is acceptable.
§ Strong analytical, problem-solving, and observation skills.
§ Excellent verbal and written communication skills in English.
§ Ability to effectively organize, prioritize, and complete tasks within deadlines.
§ Capable of understanding complex instructions and collaborating with the team to develop solutions for application challenges.
§ Strong attention to detail and ability to maintain focus on technical tasks throughout the workday.
§ Demonstrates a high level of integrity and ability to maintain strict confidentiality of laboratory results and records.
§ Proficient in Microsoft Office applications, including Word, PowerPoint, and Excel.
Benefits:
§ CPF contributions provided for Singapore Citizens and Permanent Residents only.
§ Public holidays observed in accordance with standard practice.
§ Five-day work week.
§ Medical, dental, insurance benefits provided.
