Engineer (Die Bonding, Wire Bonding)

Amplus Communication Pte Ltd

$3,500 - 4,800/Month

Hardware & Electronic

Full-Time · On-site

Minimum Diploma

1 - 3 years of experience

This job was closed

Job Requirements

On-site

1 - 3 years of experience

Minimum Diploma

Skills

Customer Relations

Assembly Process

Troubleshooting

This job post is managed by

admin Amplus Communication Pte Ltd

Job description for Engineer (Die Bonding, Wire Bonding) at Amplus Communication Pte Ltd

Responsibilities:

Develop and optimize bonding process parameters, including temperature, force, and time
Troubleshoot process deviations and work with customers on R&D requirements
Handle multi-tasks including Die Bonding, Wire Bonding, Optical alignment, and Rework processes

Requirements:

Minimum Diploma in Electronics / Mechatronic engineering
At least 2 years of engineering experience in an electronics manufacturing or related technical environment
Hands-on experience with Die Bonding, Wire Bonding
Ability to troubleshoot PCBA and perform mechanical assembly
Experience in maintaining and operating bonding machines
Ability to handle R&D customer requests
Knowledge of semiconductor packaging, advanced interconnects, or similar high-precision assembly would be an advantage
Ability to work independently and as part of a team

Amplus Communication Pte Ltd

51 - 200 employees

Amplus Communication is a leading Design, Engineering and Manufacturing company in South East Asia. Our value proposition is to leverage on our in-depth experience in RF, microwave and millimeter-wave design, attractive labour cost and established network of efficient subcontractors to offer design, manufacturing, integration and maintenance services that will help raise the competitive level of our customers and partners.

Office address

54SerangoonNorthAve4,Level4,Singapore555854

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