STMicroelectronics is seeking a highly experienced and motivated Member of Technical Staff(MTS) – NiPd APS Electroplating Process to join our advanced manufacturing team in Singapore. This role is responsible for sustaining, improving, and optimizing the NiPd plating process on APS electroplating tools supplied by a German equipment vendor. The position plays a key role in ensuring stable process performance, robust bath control, high product quality, and manufacturing excellence in a high-volume semiconductor environment.

The successful candidate will serve as a key technical contributor, working closely with Process Integration, Equipment, Manufacturing, Quality, and Technology Development teams to drive process optimization, troubleshooting, bath management, tool qualification, and continuous improvement. This role requires deep technical expertise, strong analytical skills, and proven capability in electroplating process development and manufacturing support.

Key Responsibilities

• Own and support NiPd electroplating process performance, bath stability, and manufacturability in a high-volume production environment.
• Lead technical troubleshooting for process excursions, bath instability, plating non-uniformity, tool drift, contamination, and yield detractors.
• Support process tuning, recipe optimization, equipment qualification, and chamber/tool matching for APS plating tools.
• Drive root cause analysis and implement sustainable corrective actions to improve tool availability, process capability, product quality, and yield.
• Collaborate with cross-functional teams to ensure successful technology transfer, tool readiness, and process ramp-up.
• Monitor and manage bath health using bath analysis data and support process control through Nova Ankolyzer results.
• Work with equipment and maintenance teams to strengthen preventive maintenance, calibration, and tool performance standards.
• Develop, review, and maintain technical documentation, including SOPs, BKMs, qualification reports, bath control guidelines, and process specifications.
• Mentor junior engineers and technicians, and contribute to knowledge sharing across the organization.
• Stay current with industry trends and emerging technologies in electroplating, bath management, and semiconductor wet process equipment.

Technical Qualifications

• Strong expertise in NiPd plating processes for semiconductor manufacturing.
• More than 10 years of experience in NiPd plating process development, troubleshooting, and manufacturing support.
• Deep knowledge of APS electroplating tools from the German supplier, including:

- Tool setup and operation
- Process tuning
- Recipe optimization
- Tool qualification
- Troubleshooting and process correction

• Strong understanding of electroplating bath chemistry, bath health monitoring, and plating process control.
  Experience with bath analysis and strong working knowledge of Nova Ankolyzer for bath monitoring and process support.
• Practical experience in equipment troubleshooting, process stabilization, and defect reduction.
• Solid understanding of process integration, yield improvement, and defect analysis in semiconductor manufacturing.
• Familiarity with relevant metrology and analytical methods for plating processes, such as:
  - Thickness measurement
  - Surface inspection
  - Composition verification
  - Uniformity analysis
  - Contamination monitoring
• Strong capability in DOE, SPC, data analysis, and root cause investigation.
• Experience supporting technology transfer from development to manufacturing.
• Strong written and verbal communication skills with the ability to present technical findings clearly to diverse stakeholders.
• Familiarity with fab safety, quality systems, documentation standards, and compliance requirements.

Preferred Experience

• Experience in a semiconductor high-volume manufacturing or technology transfer environment.
• Strong background in wet process equipment ownership and electroplating process support.
• Demonstrated ability to lead or contribute to cross-functional problem-solving teams.
• Proven track record of improving bath stability, plating uniformity, yield, and process capability.
• Experience in driving technical contributions through innovation, patents, publications, or impactful fab improvements.
• Exposure to ISO systems, operational excellence frameworks, and equipment maintenance practices.

Education and Experience

• Degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a closely related discipline.
• Typically 10+ years of experience in NiPd plating process development or electroplating equipment support, preferably within semiconductor manufacturing.
• Demonstrated ability to work effectively in a fast-paced, multi-functional fab environment.
• Strong record of technical ownership, collaboration, and execution excellence.