Role Summary:

OSAT Staff/ Senior PE responsible for driving assigned products NPI-to-HVM execution including test yield, quality, and productivity improvements, while ensuring alignment across Product Engineering, Test Engineering, Design, Fab, OSATs, and Business Units. The role emphasizes strategical and tactical PE functions in data mining, analysis for data driven decision making.

Responsibilities / Accountabilities:

NPI → HVM Ramp & Execution Excellence

Ensure smooth ramp of New Product Introduction (NPI) into High Volume Manufacturing (HVM) for assigned products

Drive rapid issue resolution related to product yield, test coverage, quality escapes, test time reduction, and cost optimization through disciplined cross-functional collaboration.

Ensure manufacturing readiness, risk mitigation, and adherence to Product Development PDE gate execution models.

Test Yield, Quality & Reliability Improvement

Drive test yield performance management, including yield trend monitoring, Pareto analysis, systematic yield dip diagnosis, and gap closure.

Drive statistical analysis (SPC, GR&R, Cp/Cpk), quality & ESD compliance and data-driven root cause investigations across wafer probe and final test.

Collaborate closely with Design, Product Engineering, Fab, Test Engineering, and Equipment teams to close yield and quality gaps against business targets.

Quality Monitoring and Problematic Lot Disposition Leadership

Investigation and disposition of problematic materials, including on-hold wafer lots and package test failures.

Perform deep-dive failure analysis, parametric correlation, and historical trend analysis to ensure timely and quality-compliant decisions.

Test Program Verification, Correlation & Release

Collaborate with Test Engineering and Application Engineering on test program development, verification, correlation, validation, and release.

Ensure alignment between bench, characterization, ATE, probe, and final test results before production release.

Drive robust guard-banding, limits optimization, and test coverage integrity to prevent test escapee.

Global Stakeholder Alignment & Strategy Deployment

Maintain strong collaboration with Business Unit PDE/TDE, Global Advance Test Engineering (GATE), Application Engineering, and Manufacturing Operations.

Ensure alignment on test strategy, platform roadmap, cost, capacity, and deployment plans across regions. 

Learning Development & Continuous Improvement

Build, Manage, Drive PE competency with continuous leaning development of new skills or new technology and adhere continuous improvement & Lean culture, PDCA with Plan of Record (POR) & Plan of Action (POA).

Requirements:

Bachelor’s degree in Electronic/Electrical Engineering with at least 8 years of semiconductor industry related experience

Understanding RF communication systems and RF front end component technologies. Experience working on test equipment such as ATE RF tester, handler or probers and application lab bench tools

Committed individual who is willing to travel APAC and put in extra hours as required on business needs

Good in Data Analytics and Problem Articulation

Experienced in Lean Manufacturing, PDCA, DMAIC knowledge and POR, POA execution

Experienced in using JMP, Spotfire, Power BI, Data Science, AI/AGI tools in data analytics and productivity improvement

For details, please visit our corporate website at www.qorvo.com/careers/ to find out more.