Responsibilities

• Lead end-to-end product development from concept, feasibility, design validation, qualification to production ramp
• Mentor junior engineers and provide technical leadership within the team
• Develop and execute prototype build/ new materials characterization, including optical, electrical and mechanical assessment with DOE (Design of Experiment) execution.
• Lead and resolve major issues during project and maintain documentations pertaining to engineering root cause findings
• Collaborate and drive cross functional integration across design process, packaging, test, reliability and production teams
• Analyse parametric and yield data to identify trends and drive root cause analysis. Support yield improvement, failure analysis, and reliability testing activities.
• Create and maintain engineering documentations including BOM, defect catalog, control plans and ERS.
• Drive continuous improvements in development methodologies, cost and cycle time

Requirements:

• Degree in Electrical, Electronics, Mechanical, Microelectronics, Materials, Optics or Chemical Engineering
• > 5 years in either R&D, packaging technologies, manufacturing environment
• Experience in sensor module packaging and/or optical engineering will be an advantage.
• Ability to lead/mentor junior team members and providing technical expertise in coaching them